IC Package Design Engineer | Intel Corporation | Bangalore

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Qualification & Skills:- Masters or Bachelors Degree in Electronics Engineering or relevant disciplines with 1 year experience in the related field. 
  • Requirements - Experience and/or exposure with physical layout design (Package and/or PCB) - Familiarity with package design tools like AutoCAD, Cadence Allegro, and/or Mentor Graphics Xpedition - 
  • Must understand various interface requirement like USB/DDR/PCIe etc. 
  • Good understanding of transmission line effect, crosstalk, frequency domain analysis, termination techniques, signal return path etc. 
  • Preferred - Experience in Package/Substrate technology development - Familiarity with Package layout extraction and electrical modeling/simulation tools such as PowerDC, HyperLynx, Q3D, and HFSS - 
  • Experience with scripting using languages such as Python, VB, C# .

For details & apply :Click here to apply


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